CPS TECHNOLOGIES CORP. (NASDAQ:CPSH) Files An 8-K Results of Operations and Financial Condition
Item 2.02 Results of Operations and Financial Condition
On February 24, 2021, the Company issued a press release announcing its financial results for the fiscal quarter and year ended December 26, 2020. A copy of the press release is attached hereto as Exhibit 99 and is incorporated herein in its entirety by reference.
Cautionary Note Regarding Forward-Looking Statements. Except for historical information contained in the press release attached as an exhibit hereto, the press release contains forward-looking statements which involve certain risks and uncertainties that could cause actual results to differ materially from those expressed or implied by these statements. Please refer to the cautionary note in the press release regarding these forward-looking statements.
Item 9.01 Financial Statements and Exhibits
|99.1||Press release dated February 24, 2021 of CPS Technologies Corp. announcing its financial results for the fiscal quarter and year ended December 26, 2020.|
CPS TECHNOLOGIES CORP/DE/ Exhibit
EX-99 2 prq42020prr.htm EX99.1 Q4 2020 FINANCIAL RESULTS PRESS RELEASE CPS Technologies Corporation Chuck Griffith,…
To view the full exhibit click
About CPS TECHNOLOGIES CORP. (NASDAQ:CPSH)
CPS Technologies Corporation (CPS) provides material solutions to the transportation, automotive, energy, computing/Internet, telecommunications, aerospace, defense, and oil and gas end markets. Its primary material solution is metal matrix composites (MMCs), which are a class of materials consisting of a combination of metal and ceramic. It designs, manufactures and sells custom MMC components, which manages the performance and reliability of systems in the end markets. It provides lids and heat spreaders used with integrated circuits in Internet switches and routers. It provides baseplates and housings used in modules built with wide band gap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN). The Company also assembles housings and packages for hybrid circuits. These housings and packages may include MMC components. Its products are manufactured by processes, including the Quickset Injection Molding Process and the QuickCast Pressure Infiltration Process.