Nanometrics Incorporated (NASDAQ:NANO) Files An 8-K Results of Operations and Financial ConditionItem 2.02 – Results of Operations and Financial Condition.
On October 12, 2017, Nanometrics Incorporated issued a press release announcing preliminary financial results for its fiscal third quarter ended September 30, 2017. A copy of the press release is attached as Exhibit 99.1 to this current report on Form 8-K and is incorporated herein by reference.
The information in this current report on Form 8-K and the exhibit attached hereto shall not be deemed “filed” for purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”) nor otherwise subject to the liabilities of that section, nor shall it be deemed incorporated by reference in any filing under the Securities Act of 1933, as amended, or the Exchange Act, regardless of any general incorporation language in such filing.
Item 2.02 – Financial Statements and Exhibits.
NANOMETRICS INC ExhibitEX-99.1 2 nano-ex991_6.htm EX-99.1 nano-ex991_6.htm Exhibit 99.1 Nanometrics Incorporated 1550 Buckeye Drive Milpitas,…To view the full exhibit click
About Nanometrics Incorporated (NASDAQ:NANO)
Nanometrics Incorporated (Nanometrics) provides process control metrology and inspection systems used in the fabrication of integrated circuits, high-brightness light emitting diodes (HB-LEDs), discrete components and data storage devices. The Company operates in the segment of sale, design, manufacture, marketing and support of thin film and optical critical dimension systems. The Company’s automated and integrated systems address process control applications, including critical dimension and film thickness measurement, device topography, defect inspection, and analysis of various other film properties, such as optical, electrical and material characteristics. The Company’s process control solutions are deployed throughout the fabrication process, from front-end-of-line substrate manufacturing, to high-volume production of semiconductors and other devices, to advanced wafer-scale packaging applications.