CPS TECHNOLOGIES CORP. (NASDAQ:CPSH) Files An 8-K Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers
Item 5.02 Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers
On May 13, 2021. CPS Technologies Corporation (NASDAQ:CPSH) announced that Grant Bennett decided to retire as president and CEO of the Company effective July 1, 2021. He will continue to serve as a member of the Board of Directors. He will be succeeded as president and chief executive officer by Michael McCormack who is currently the COO. Michael McCormack is 58 years old, was previously Executive Vice President at AirBoss Defense Group, Executive Vice President with Mission Solutions Group and prior to that CEO at Critical Solutions International.
The Company issued a press release relating to this on May 13, 2021, the press release is attached hereto as Exhibit 99 and is incorporated herein in its entirety by reference.
Item 9.01. Financial Statements and Exhibits.
|99.1||Press Release dated May 13, 2021|
CPS TECHNOLOGIES CORP/DE/ Exhibit
EX-99 2 prceo05132021tr.htm EXHIBIT 99.1 PRESS RELEASE DATED MAY 13,…
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About CPS TECHNOLOGIES CORP. (NASDAQ:CPSH)
CPS Technologies Corporation (CPS) provides material solutions to the transportation, automotive, energy, computing/Internet, telecommunications, aerospace, defense, and oil and gas end markets. Its primary material solution is metal matrix composites (MMCs), which are a class of materials consisting of a combination of metal and ceramic. It designs, manufactures and sells custom MMC components, which manages the performance and reliability of systems in the end markets. It provides lids and heat spreaders used with integrated circuits in Internet switches and routers. It provides baseplates and housings used in modules built with wide band gap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN). The Company also assembles housings and packages for hybrid circuits. These housings and packages may include MMC components. Its products are manufactured by processes, including the Quickset Injection Molding Process and the QuickCast Pressure Infiltration Process.