CEVA, INC. (NASDAQ:CEVA) Files An 8-K Regulation FD Disclosure
ITEM 7.01. REGULATION FD DISCLOSURE
On January 14, 2019, CEVA, Inc. (the “Company”) will be hosting an investor and analyst day at the Nasdaq MarketSite in New York City beginning at 9:45 a.m. Eastern time. The Company is furnishing as Exhibit 99.1 to this Current Report on Form 8-K the presentation materials to be discussed with attendees at the investor and analyst day. The event will be webcast on the Investor Relations section of the Company’s website at https://investors.ceva-dsp.com.
The information in this Current Report on Form 8-K (including the presentation materials attached as Exhibit 99.1 hereto and the webcast) is being furnished to Item 7.01 of Form 8-K and shall not be deemed to be “filed” for the purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”), or otherwise subject to the liabilities of that section, nor shall it be deemed to be incorporated by reference in any filing under the Securities Act of 1933, as amended, or the Exchange Act. This current report on Form 8-K will not be deemed an admission as to the materiality of any information contained herein (including the presentation materials attached as Exhibit 99.1 hereto and the webcast).
ITEM 9.01. FINANCIAL STATEMENTS AND EXHIBITS.
CEVA INC Exhibit
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About CEVA, INC. (NASDAQ:CEVA)
CEVA, Inc. (CEVA) is a licensor of signal processing intellectual property (IP). The Company partners with semiconductor companies and original equipment manufacturers (OEMs) to create connected devices for a range of end markets, including mobile, consumer, automotive, industrial and Internet of things (IoT). The Company operates in the segment of licensing of intellectual property to semiconductor companies and electronic equipment manufacturers. It addresses the requirements of the mobile, consumer, automotive, industrial and IoT markets by designing and licensing application-specific signal processing platforms, which enable the design of solutions for developing a range of applications, including communications and connectivity, audio and voice, imaging and vision, and storage. It has research and development facilities in Israel, France, Ireland and the United Kingdom, and sales and support offices throughout Asia Pacific, Japan, Sweden, France, Israel and the United States.