On July 18, 2019, Aehr Test Systems, or the Company, issued a press release announcing the Company’s financial results for its fourth quarter and fiscal year ended May 31, 2019. A copy of the press release is attached as Exhibit 99.1 to this Current Report on Form 8-K.

The information in this Form 8-K, including the exhibit attached hereto, are being furnished and shall not be deemed “filed” for purposes of Section 18 of the Securities Act of 1934, as amended, or the Exchange Act, or otherwise subject to the liabilities of that Section, or incorporated by reference in any filing under the Securities Act of 1933, as amended, or the Exchange Act, except as shall be expressly set forth by specific reference in such filing.

Item 9.01. Financial Statements and Exibits.

(d) Exhibits.

AEHR TEST SYSTEMS Exhibit
EX-99.1 2 aehr_ex991.htm PRESS RELEASE Blueprint     Exhibit 99.1     FOR IMMEDIATE RELEASE   Contacts:   Aehr Test Systems MKR Investor Relations Inc. Ken Spink Todd Kehrli or Jim Byers Chief Financial Officer Analyst/Investor Contact (510) 623-9400 x309 (323) 468-2300   [email protected]   Aehr Test Systems Reports Fiscal 2019 Fourth Quarter and Full Year Results and Provides Financial Guidance for Significant Growth in Fiscal 2020   Fremont,…
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About AEHR TEST SYSTEMS (NASDAQ:AEHR)

Aehr Test Systems is engaged in the designing, manufacturing and marketing of advanced test and burn-in products to the semiconductor manufacturing industry. The Company manufactures and markets full wafer contact test systems, test during burn-in systems, test fixtures, die carriers and related accessories. The Company’s principal products are the Advanced Burn-In and Test System (ABTS), the FOX full wafer contact parallel test and burn-in systems, WaferPak full wafer contactor, the DiePak carrier and test fixtures. The Company develops, manufactures and sells systems, which are designed to reduce the cost of testing and to perform reliability screening, or burn-in, of complex logic devices, memory integrated circuits (ICs), sensors and optical devices. These systems can be used to perform parallel testing and burn-in of packaged ICs, singulated bare die or ICs still in wafer form.