QuickLogic Corporation (NASDAQ:QUIK) Files An 8-K Results of Operations and Financial Condition

QuickLogic Corporation (NASDAQ:QUIK) Files An 8-K Results of Operations and Financial Condition
Item 2.02 Results of Operation and Financial Condition.

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On August9, 2017, QuickLogic Corporation (“QuickLogic”) issued a press release regarding it’s financial results for the fiscal 2017 second quarter ended July 2, 2017. A copy of the press release is attached hereto as Exhibit 99.1 and is incorporated herein by reference.

This information, including Exhibit 99.1, shall not be deemed “filed” for purposes of Section18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”), or otherwise subject to the liability of that Section, and shall not be incorporated by reference in any filing under the Securities Act of 1933, as amended, or the Exchange Act, except as shall be expressly set forth by specific reference in such filing.

QuickLogic is making reference to non-GAAP financial information in the press release. A reconciliation of GAAP to non-GAAP results is provided in the attached Exhibit 99.1 press release.

Section9 – Financial Statements and Exhibits

Item 2.02(d) Exhibits.

The following exhibit is furnished as a part of this report:

99.1

Press release of QuickLogic Corporation reporting financial results for the fiscal 2017 second quarter ended July 2, 2017.


QUICKLOGIC CORPORATION Exhibit
EX-99.1 2 exhibit991-q2x17.htm EXHIBIT 99.1 Exhibit Exhibit 99.1 QuickLogic Reports Fiscal 2017 Second Quarter ResultsSUNNYVALE,…
To view the full exhibit click here

About QuickLogic Corporation (NASDAQ:QUIK)

QuickLogic Corporation develops and markets semiconductor and software algorithm solutions. The Company’s solutions primarily target smartphones, wearable devices, tablets, and the Internet-of-Things (IoT). The Company is a fabless semiconductor provider of flexible sensor processing solutions, ultra-low power display bridges, and ultra-low power Field Programmable Gate Arrays (FPGAs). The Company’s solutions integrate multi-core processing, programmable logic, sensor fusion and context aware algorithms, and embedded software. The Company’s solutions are created from its new silicon platforms, including EOS, ArcticLink III, PolarPro 3, PolarPro II, PolarPro, and Eclipse II products, its mature products, which are produced on semiconductor processes over 180 nanometers, primarily include its pASIC 3 and QuickRAM, as well as royalty revenue, programming hardware and design software. Its sensor algorithm software includes SenseMe software library.

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