KULICKE AND SOFFA INDUSTRIES, INC. (NASDAQ:KLIC) Files An 8-K Submission of Matters to a Vote of Security Holders
Item 5.07
Submission of Matters to a Vote of Security Holders
Kulicke and Soffa Industries, Inc. (the “Company”) held its Annual Meeting of Shareholders on February 27, 2019 (the “2019 Annual Meeting”).
The Company’s shareholders elected Dr. Fusen E. Chen and Mr. Gregory F. Milzcik as directors to serve until the 2023 Annual Meeting of Shareholders and until their successors have been duly elected and qualified. The votes were cast as follows:
|
For |
Withhold |
Broker Non-Votes |
|
|
Fusen E. Chen |
51,995,061 |
478,158 |
8,537,596 |
|
Gregory F. Milzcik |
51,671,327 |
801,892 |
8,537,596 |
The Company’s shareholders ratified the appointment of PricewaterhouseCoopers LLP as the Company’s independent registered public accounting firm for the fiscal year ending September 28, 2019. The votes were cast as follows:
|
For |
Against |
Abstain |
|
59,983,383 |
854,883 |
172,549 |
The Company’s shareholders approved, on a non-binding basis, the overall compensation of the Company’s named executive officers as described in the Compensation Discussion and Analysis and the accompanying tabular and narrative disclosure included in the Company’s Proxy Statement for the 2019 Annual Meeting. The votes were cast as follows:
|
For |
Against |
Abstain |
Broker Non-Votes |
|
51,210,753 |
1,170,368 |
92,098 |
8,537,596 |
About KULICKE AND SOFFA INDUSTRIES, INC. (NASDAQ:KLIC)
Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools, as well as services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. The Company operates through two segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The Expendable Tools segment manufactures and sells expendable tools for a range of semiconductor packaging applications. It offers capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits, high and low powered discrete devices, light-emitting diodes and power modules. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers and automotive electronics suppliers.
