KULICKE AND SOFFA INDUSTRIES, INC. (NASDAQ:KLIC) Files An 8-K Results of Operations and Financial Condition

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KULICKE AND SOFFA INDUSTRIES, INC. (NASDAQ:KLIC) Files An 8-K Results of Operations and Financial Condition
Item 2.02Results of Operations and Financial Condition.

On November14, 2017, Kulicke and Soffa Industries, Inc. (the “Company”) issued a press release announcing its financial results for its fourth fiscal quarter ended September30, 2017 and for its fiscal year ended September30, 2017. A copy of this press release is furnished as Exhibit 99.1 to this report, and is incorporated by reference into this Item 2.02 as if fully set forth herein.

The information in this report, furnished under “Item 2.02 Results of Operations and Financial Condition,” shall not be deemed “filed” for purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”), nor shall it be deemed incorporated by reference in any filing under the Securities Act of 1933, as amended, or the Exchange Act, except as shall be expressly set forth by specific reference in such filing.

Item 9.01

Financial Statements and Exhibits.

(d)

Exhibits.

Exhibit No.

Description

99.1

Press Release dated November 14, 2017.


KULICKE & SOFFA INDUSTRIES INC Exhibit
EX-99.01 2 exhibit9912017.htm EXHIBIT 99.01 Exhibit Exhibit 99.1K&S Corporate HeadquartersKulicke & Soffa Pte Ltd23A Serangoon North Ave 5#01-01,…
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About KULICKE AND SOFFA INDUSTRIES, INC. (NASDAQ:KLIC)

Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools, as well as services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. The Company operates through two segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The Expendable Tools segment manufactures and sells expendable tools for a range of semiconductor packaging applications. It offers capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits, high and low powered discrete devices, light-emitting diodes and power modules. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers and automotive electronics suppliers.

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