KULICKE AND SOFFA INDUSTRIES, INC. (NASDAQ:KLIC) Files An 8-K Other Events
Item 8.01 Other Events.
On February 28, 2019, Kulicke and Soffa Industries, Inc. (the “Company”) issued a press release announcing that the Board of Directors of the Company has declared and authorized a quarterly dividend of $0.12 per share of common stock. The dividend payment will be made on April 15, 2019 to holders of record as of March 28, 2019. A copy of this press release is furnished as Exhibit 99.1 to this report.
The information in this report, furnished under “Item 8.01 Other Events,” shall not be deemed “filed” for purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”), nor shall it be deemed incorporated by reference in any filing under the Securities Act of 1933, as amended, or the Exchange Act, except as shall be expressly set forth by specific reference in such filing.
Financial Statements and Exhibits.
Press Release dated February 28, 2019
KULICKE & SOFFA INDUSTRIES INC Exhibit
EX-99.1 2 exhibit991feb282019.htm EXHIBIT 99.1 Exhibit Exhibit 99.1K&S Corporate HeadquartersKulicke & Soffa Pte Ltd23A Serangoon North Ave 5#01-01,…
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About KULICKE AND SOFFA INDUSTRIES, INC. (NASDAQ:KLIC)
Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools, as well as services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. The Company operates through two segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The Expendable Tools segment manufactures and sells expendable tools for a range of semiconductor packaging applications. It offers capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits, high and low powered discrete devices, light-emitting diodes and power modules. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers and automotive electronics suppliers.