ICHOR HOLDINGS, LTD. (NASDAQ:ICHR) Files An 8-K Entry into a Material Definitive Agreement

ICHOR HOLDINGS, LTD. (NASDAQ:ICHR) Files An 8-K Entry into a Material Definitive Agreement
Item 1.01 Entry into a Material Definitive Agreement.

Amendment to Credit Agreement

On December11, 2017, Ichor Holdings, LLC and certain of its subsidiaries entered into the Third Amendment(the “Third Amendment”) to the Credit Agreement (the “Credit Agreement”) by and among Ichor Holdings, LLC, Ichor Systems, Inc., Precision Flow Technologies, Inc., Ajax-United Patterns& Molds, Inc., Cal-Weld, Talon Innovations Corporation and Talon Innovations (FL) Corporation as borrowers, Bank of America, N.A., as administrative agent, and the financial institutions party thereto, as lenders. The Credit Agreement governs the Company’s credit facility that includes a revolver and a term loan facility. TheThird Amendment increased the amount available to the Company for borrowing under the term loan facility by $120million.

Item 1.01. Creation of a Direct Financial Obligation or an Obligation under an Off-Balance Sheet Arrangement of Registrant.

The information set forth under Item 1.01 under the heading “Amendment to Credit Agreement” is incorporated herein by reference.

Item 1.01. Financial Statements and Exhibits.

(d) Exhibits

10.1 Third Amendment to the Credit Agreement, dated as of December 11, 2017, by and among Ichor Holdings, LLC, Ichor Systems, Inc., Precision Flow Technologies, Inc., Ajax-United Patterns & Molds, Inc., Cal-Weld, Inc., Talon Innovations Corporation and Talon Innovations (FL) Corporation, as borrowers, Bank of America, N.A., as administrative agent, and the financial institutions party thereto, as lenders.


ICHOR HOLDINGS, LTD. Exhibit
EX-10.1 2 d505754dex101.htm EX-10.1 EX-10.1 Exhibit 10.1 Execution Version THIRD AMENDMENT TO CREDIT AGREEMENT THIS THIRD AMENDMENT TO CREDIT AGREEMENT (this “Amendment”) is made as of December 11,…
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About ICHOR HOLDINGS, LTD. (NASDAQ:ICHR)

Ichor Holdings, Ltd. is engaged in the design, engineering and manufacturing of fluid delivery subsystems for semiconductor capital equipment. The Company’s primary offerings include gas and chemical delivery subsystems, collectively known as fluid delivery subsystems. Its gas delivery systems consist of gas lines, each controlled by a series of mass flow controllers, regulators, pressure transducers and valves, and an integrated electronic control system. Its gas delivery subsystems are used in equipment for dry manufacturing processes, such as etch, physical vapor deposition, epitaxy and strip. Its chemical delivery subsystems are used to precisely blend and dispense reactive chemistries and colloidal slurries critical to the specific wet front-end process, such as wet clean, electro chemical deposition (ECD) and chemical-mechanical planarization (CMP). It manufactures various components for internal use in fluid delivery systems and for direct sales to its customers.

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