This Amendment No. 1 to Current Report on Form 8-K/A amends the Current Report on Form 8-K originally filed by Cypress Semiconductor Corporation (the “Company”) on June 26, 2017 and is being filed to provide additional information in accordance with Item 5.07(d) of Form 8-K. As previously reported by the Company, at the Company’s annual meeting of stockholders held on June 20, 2017, the Company’s stockholders selected, on a non-binding advisory basis, one year as the frequency with which the Company will hold a non-binding advisory vote to approve the compensation paid by the Company to certain of its executive officers in accordance with U.S. Securities and Exchange Commission rules and regulations (the “Say-on-Pay”). Based on these results and consistent with the Company’s recommendation, on August 4, 2017 the Company’s Board of Directors (the "Board") determined that the Company will conduct future Say-on-Pay votes on an annual basis. The Company’s Board will re-evaluate this determination following the next stockholder advisory vote on the frequency of Say-on-Pay votes, which is required to occur no later than the Company's annual (or other) meeting of stockholders held in 2023.

About CYPRESS SEMICONDUCTOR CORPORATION (NASDAQ:CY)

Cypress Semiconductor Corporation delivers solutions from automotive, industrial and networking platforms to interactive consumer and mobile devices. The Company’s segments include Programmable Systems Division, Memory Products Division, Data Communications Division and Emerging Technologies Division. The Programmable Solutions Division designs and develops solutions for end-product manufacturers. The Memory Products Division designs and manufactures portfolio of high-performance memories for embedded systems. The Data Communications Division focuses on solutions for industrial, handset and consumer applications. The Emerging Technologies Division consists of its subsidiaries, AgigA Tech, Inc. and Deca Technologies, Inc. Its product portfolio includes NOR flash memories, Traveo microcontrollers, programmable system-on-chip solutions, CapSense capacitive touch-sensing controllers, and Wireless Bluetooth Low-Energy and universal serial bus (USB) connectivity solutions.