Cabot Microelectronics Corporation (NASDAQ:CCMP) Files An 8-K Other Events

ME Staff 8-k
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Cabot Microelectronics Corporation (NASDAQ:CCMP) Files An 8-K Other Events

Cabot Microelectronics Corporation (NASDAQ:CCMP) Files An 8-K Other Events
Item 8.01Other Events.

On September 26, 2018, Cabot Microelectronics Corporation (the "Company") issued a press release announcing that its Board of Directors has declared a quarterly cash dividend of $0.40 per share ($1.60 per share on an annualized basis) on the Company's common stock. The dividend will be payable on or about October 30, 2018 to shareholders of record at the close of business on October 9, 2018. The declaration and payment of future dividends is subject to the discretion and determination of the Company's Board of Directors and management, based on a variety of factors, and the program may be suspended, terminated or modified at any time for any reason.

(d)

Exhibits

Exhibit No.

Description

99.1

Press release, dated September 26, 2018, entitled "Cabot Microelectronics Corporation Declares Quarterly Cash Dividend."


CABOT MICROELECTRONICS CORP Exhibit
EX-99.1 2 exhibit99_1.htm EXHIBIT 99.1 PRESS RELEASE  Contact:  Colleen Mumford  Director of Investor Relations  Cabot Microelectronics Corporation   (630) 499-2600 Cabot Microelectronics Corporation Declares Quarterly Cash Dividend Aurora,…
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About Cabot Microelectronics Corporation (NASDAQ:CCMP)

Cabot Microelectronics Corporation supplies polishing slurries and pads used in the manufacture of integrated circuit (IC) devices within the semiconductor industry, in a process called chemical mechanical planarization (CMP). The Company is engaged in the development, manufacture and sale of CMP consumables. The Company develops, produces and sells CMP slurries for polishing conducting and insulating materials used in IC devices, and also for polishing the disk substrates and magnetic heads used in hard disk drives. It also develops, manufactures and sells CMP polishing pads, which are used in conjunction with slurries in the CMP process. The Company also pursues other surface modification applications through its engineered surface finishes (ESF) business. The Company offers CMP polishing pads, under the Epic and NexPlanar brand names, for a range of applications and technology nodes.