BENCHMARK ELECTRONICS, INC. (NYSE:BHE) Files An 8-K Results of Operations and Financial Condition

BENCHMARK ELECTRONICS, INC. (NYSE:BHE) Files An 8-K Results of Operations and Financial Condition
Item 2.02. Results of Operations and Financial Condition.

On July 24, 2018, Benchmark Electronics, Inc. (the “Company”) issued a press release announcing its results of operations for the quarter ended June 30, 2018. A copy of the press release and accompanying investor presentation are attached hereto as Exhibits 99.1 and 99.2, respectively, and incorporated by reference herein. The information disclosed under this Item 2.02, including Exhibits 99.1 and 99.2 hereto, shall not be deemed “filed” for purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”), or deemed incorporated by reference in any filing under the Securities Act of 1933, as amended, or the Exchange Act, except as shall be expressly set forth by specific reference in such a filing.

Item 9.01. Financial Statements and Exhibits.

(d) Exhibits


BENCHMARK ELECTRONICS INC Exhibit
EX-99.1 2 ex991.htm EXHIBIT 99.1       Exhibit 99.1 FOR IMMEDIATE RELEASE   BENCHMARK ELECTRONICS REPORTS SECOND QUARTER 2018 RESULTS   ·          Quarterly revenue of $661 million ·          Quarterly operating margin of 2.2% (2.7% non-GAAP) ·          Quarterly EPS of $0.23 ($0.30 non-GAAP)   SCOTTSDALE,…
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About BENCHMARK ELECTRONICS, INC. (NYSE:BHE)

Benchmark Electronics, Inc. is a provider of integrated electronic manufacturing services. The Company provides services to original equipment manufacturers of industrial control equipment, including equipment for the aerospace and defense industry; telecommunication equipment; computers and related products for business enterprises; medical devices, and testing and instrumentation products. It has three segments: the Americas, Asia and Europe. It offers integrated design and manufacturing services. Its operations consist of over three principal areas: manufacturing and assembly operations, including printed circuit boards assemblies and subsystem assembly, box build and systems integration; precision technology manufacturing, which include precision machining, metal joining, assembly and functional testing, and specialized engineering services, and specialized engineering services, such as product design, printed circuit board layout, prototyping, automation and test development.

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