BENCHMARK ELECTRONICS, INC. (NYSE:BHE) Files An 8-K Results of Operations and Financial Condition

BENCHMARK ELECTRONICS, INC. (NYSE:BHE) Files An 8-K Results of Operations and Financial Condition
Item 2.02. Results of Operations and Financial Condition.

On February 7, 2018, we issued a press release announcing our results of operations for the quarter and year ended December 31, 2017. The press release, attached as Exhibit 99.1 and incorporated herein by reference, is being furnished to the SEC.

Item 7.01. Regulation FD Disclosure.

On February 7, 2018, we held an earnings conference call. The presentation slides used in connection with the conference call are being furnished to the SEC, are attached as Exhibit 99.2 to this report and are hereby incorporated herein by reference.

Item 9.01. Financial Statements and Exhibits.

(d) Exhibits

Exhibit 99.1 Press release

Exhibit 99.2 Presentation slides


BENCHMARK ELECTRONICS INC Exhibit
EX-99.1 2 ex991.htm EXHIBIT 99.1       EXHIBIT 99.1 FOR IMMEDIATE RELEASE   BENCHMARK ELECTRONICS REPORTS FOURTH QUARTER AND FY 2017 RESULTS   ·          Quarterly revenue of $680 million ·          Quarterly operating margin of 3.4% (4.2% non-GAAP) ·          Quarterly loss per share of $1.54 and non-GAAP EPS of $0.49 ·          Annual loss per share of $0.64 and non-GAAP EPS of $1.61   SCOTTSDALE,…
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About BENCHMARK ELECTRONICS, INC. (NYSE:BHE)

Benchmark Electronics, Inc. is a provider of integrated electronic manufacturing services. The Company provides services to original equipment manufacturers of industrial control equipment, including equipment for the aerospace and defense industry; telecommunication equipment; computers and related products for business enterprises; medical devices, and testing and instrumentation products. It has three segments: the Americas, Asia and Europe. It offers integrated design and manufacturing services. Its operations consist of over three principal areas: manufacturing and assembly operations, including printed circuit boards assemblies and subsystem assembly, box build and systems integration; precision technology manufacturing, which include precision machining, metal joining, assembly and functional testing, and specialized engineering services, and specialized engineering services, such as product design, printed circuit board layout, prototyping, automation and test development.

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