BENCHMARK ELECTRONICS, INC. (NYSE:BHE) Files An 8-K Results of Operations and Financial ConditionItem 2.02. Results of Operations and Financial Condition.
On October 18, 2017, we issued a press release announcing our results of operations for the quarter ended September 30, 2017. The press release, attached as Exhibit 99.1 and incorporated herein by reference, is being furnished to the SEC.
Item 5.02. Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers.
Don Adam, our Chief Financial Officer, notified the Company on October 13, 2017 of his decision to retire. As indicated in the press release, his retirement is expected to be effective by the end of the year, and a search is underway for his successor.
Item 7.01. Regulation FD Disclosure.
On October 18, 2017, we held an earnings conference call. The presentation slides used in connection with the conference call are being furnished to the SEC, are attached as Exhibit 99.2 to this report and are hereby incorporated herein by reference.
Item 9.01. Financial Statements and Exhibits.
Exhibit 99.1 Press release
Exhibit 99.2 Presentation slides
BENCHMARK ELECTRONICS INC ExhibitEX-99.1 2 ex99_1.htm EXHIBIT 99.1 Exhibit 99.1 FOR IMMEDIATE RELEASE BENCHMARK ELECTRONICS REPORTS THIRD QUARTER 2017 RESULTS · Quarterly revenue of $604 million · Quarterly operating margin of 3.4% (4.1% non-GAAP) · Quarterly EPS of $0.35 ($0.39 non-GAAP) SCOTTSDALE,…To view the full exhibit click
About BENCHMARK ELECTRONICS, INC. (NYSE:BHE)
Benchmark Electronics, Inc. is a provider of integrated electronic manufacturing services. The Company provides services to original equipment manufacturers of industrial control equipment, including equipment for the aerospace and defense industry; telecommunication equipment; computers and related products for business enterprises; medical devices, and testing and instrumentation products. It has three segments: the Americas, Asia and Europe. It offers integrated design and manufacturing services. Its operations consist of over three principal areas: manufacturing and assembly operations, including printed circuit boards assemblies and subsystem assembly, box build and systems integration; precision technology manufacturing, which include precision machining, metal joining, assembly and functional testing, and specialized engineering services, and specialized engineering services, such as product design, printed circuit board layout, prototyping, automation and test development.