BENCHMARK ELECTRONICS, INC. (NYSE:BHE) Files An 8-K Other Events

BENCHMARK ELECTRONICS, INC. (NYSE:BHE) Files An 8-K Other Events
ITEM 8.01 OTHER EVENTS

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On March 7, 2018, the Board of Directors of Benchmark Electronics, Inc. (the Company) expanded an existing share repurchase program by $250 million. On October 26, 2018, the Board authorized the repurchase of an additional $100 million of the Company’s common stock. Net of shares repurchased to date, the total remaining authorization outstanding is $262 million.

The repurchases may be made from time to time in the open market, in privately negotiated transactions, or otherwise, including to a Rule 10b5-1 plan, at prices that the Company deems appropriate and subject to market conditions, applicable law and other factors deemed relevant in the Company’s sole discretion. The Company intends to pay for shares repurchased with cash from its balance sheet.

A copy of the press release announcing the expansion of the stock repurchase program is attached hereto as Exhibit 99.1

ITEM 9.01 FINANCIAL STATEMENTS AND EXHIBITS

(d)Exhibits.

Exhibit No.

Description of Exhibit

99.1

Press Release


BENCHMARK ELECTRONICS INC Exhibit
EX-99.1 2 ex99_1.htm EXHIBIT 99.1            Exhibit 99.1   FOR IMMEDIATE RELEASE   BENCHMARK ELECTRONICS ANNOUNCES EXPANSION OF STOCK REPURCHASE PROGRAM   SCOTTSDALE,…
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About BENCHMARK ELECTRONICS, INC. (NYSE:BHE)

Benchmark Electronics, Inc. is a provider of integrated electronic manufacturing services. The Company provides services to original equipment manufacturers of industrial control equipment, including equipment for the aerospace and defense industry; telecommunication equipment; computers and related products for business enterprises; medical devices, and testing and instrumentation products. It has three segments: the Americas, Asia and Europe. It offers integrated design and manufacturing services. Its operations consist of over three principal areas: manufacturing and assembly operations, including printed circuit boards assemblies and subsystem assembly, box build and systems integration; precision technology manufacturing, which include precision machining, metal joining, assembly and functional testing, and specialized engineering services, and specialized engineering services, such as product design, printed circuit board layout, prototyping, automation and test development.

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