Amtech Systems, Inc. (NASDAQ:ASYS) Files An 8-K Regulation FD DisclosureItem 7.01
The information contained in this Current Report, including the accompanying Exhibit 99.1 is furnished to Item 7.01 of Form 8-K and shall not be incorporated by reference into any filing of the Registrant, whether made before or after the date hereof, regardless of any general incorporation language in such filing, unless expressly incorporated by specific reference in such filing. The information in this Current Report, including the accompanying exhibit, shall not be deemed to be “filed” for purposes of Section 18 of the Securities Exchange Act of 1934, as amended, or otherwise subject to the liabilities of that section or Sections 11 and 12(a)(2) of the Securities Act of 1933, as amended.
Section 9 – Financial Statements and Exhibits
Item 9.01Financial Statements and Exhibits.
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Exhibit No. |
Description |
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99.1 |
Press Release dated August 17, 2017 |
AMTECH SYSTEMS INC ExhibitEX-99.1 2 q42017offeringannouncement.htm EXHIBIT 99.1 Exhibit EXHIBIT 99.1Amtech Announces Proposed Public Offering of Common StockTEMPE,…To view the full exhibit click here
About Amtech Systems, Inc. (NASDAQ:ASYS)
Amtech Systems, Inc. is engaged in the manufacture of capital equipment, including thermal processing, silicon wafer handling automation and related consumables used in fabricating solar cells, Light Emitting Diode (LED) and semiconductor devices. The Company operates through three business segments: solar, semiconductor and polishing. The solar segment supplies thermal processing systems, including diffusion; plasma-enhanced chemical vapor deposition (PECVD); atomic layer deposition (ALD), and related automation, parts and services to the solar/photovoltaic industry. The semiconductor segment supplies thermal processing equipment, including solder reflow equipment and related controls for use by the semiconductor manufacturers and in electronics assembly for automotive and other industries. The polishing supplies segment produces consumables and machinery for lapping (fine abrading) and polishing of materials, such as sapphire substrates and optical components.
