Micropac Industries, Inc. (OTCMKTS:MPAD) Files An 8-K Submission of Matters to a Vote of Security Holders

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Micropac Industries, Inc. (OTCMKTS:MPAD) Files An 8-K Submission of Matters to a Vote of Security Holders

Item 5.07 of the Original Form 8-K. No other changes were made to
the Original Form 8-K.

Item 5.07: Submission of Matters to a Vote of Security Holders

(a) The Company held its 2017 annual meeting of stockholders (the
Annual Meeting) on

March 10, 2017.

(b) At the Annual Meeting, stockholders voted on the following
two proposals (described in detail in the Companys definitive
proxy statement filed with the Securities and Exchange Commission
on February 09, 2017). The final results for each of the matters
submitted to a vote of stockholders at the Annual Meeting are as
follows:

Proposal One: The five director nominees received the following
votes:

Nominee For Withheld
Heinz-Werner Hempel 2,076,297 1,425
Mark W. King 2,076,622 1,100
Richard Hoesterey 2,022,442 55,280
Eugene A. Robinson 2,075,522 2,200
Christine B. Dittrich 2,075,522 2,200

All five nominees listed above were elected to serve for a term
ending at the Companys 2018 annual meeting of stockholders.

Proposal Two: The Say on Pay non-binding advisory vote on the
compensation of the named executive officers of the Company
received the following votes:

For Against Abstain
2,021,172 54,030 2,520

The advisory proposal was approved.

Dated 04/20/2017 MICROPAC INDUSTRIES, INC.
(Registrant)
/s/ Mark King
(


About Micropac Industries, Inc. (OTCMKTS:MPAD)

Micropac Industries, Inc. manufactures and distributes various types of hybrid microelectronic circuits, solid state relays, power controllers, and optoelectronic components and assemblies. The Company’s products are used as components in a range of military, space and industrial systems, including aircraft instrumentation and navigation systems, power supplies, electronic controls, computers, medical devices, and high-temperature products. The Company’s core technology is the packaging and interconnecting of multi-chip microelectronics modules. Other technologies include light emitting, and light sensitive materials and products, including light emitting diodes and silicon phototransistors used in the Company’s optoelectronic components and assemblies. The Company provides power management and controls, sensors and displays, and optocouplers products, components and assemblies.

Micropac Industries, Inc. (OTCMKTS:MPAD) Recent Trading Information

Micropac Industries, Inc. (OTCMKTS:MPAD) closed its last trading session 00.00 at 8.25 with 200 shares trading hands.