Effective November 3, 2017, the Management Development and Compensation Committee (the “Committee”) of the board of directors of Kulicke and Soffa Industries, Inc. (the “Company”) approved the following forms of award agreements in connection with the Company’s 2017 Equity Plan (the “Plan”): (i) form of Performance Share Unit Award Agreement; and (ii) form of Restricted Share Unit Award Agreement. The form of award agreements will be used in connection with compensation awards granted to the Company’s employees and non-employee directors under the Plan.
Restricted share units granted to the Company’s employees and non-employee directors will generally vest in equal installments over no less than three years based on the employee’s continued employment, subject to acceleration in certain circumstances. Performance share units granted to the Company’s employees will cliff vest after a specified performance period (generally three years) based on the achievement of performance goals.
This description of the restricted share units and performance share units granted under the Plan is qualified in its entirety by reference to the forms of Award Agreement, which are attached as Exhibits 10.1 and 10.2 and incorporated herein by reference.
Item 9.01
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Financial Statements and Exhibits.
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(d)
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Exhibits.
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Exhibit No.
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Description
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10.1
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Form of Performance Share Unit Award Agreement under the Company’s 2017 Equity Plan
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10.2
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Form of Restricted Share Unit Award Agreement under the Company’s 2017 Equity Plan
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KULICKE & SOFFA INDUSTRIES INC ExhibitEX-10.1 2 exhibit101-2017.htm EXHIBIT 10.1 Exhibit Exhibit 10.1KULICKE AND SOFFA INDUSTRIES,…To view the full exhibit click here
About KULICKE AND SOFFA INDUSTRIES, INC. (NASDAQ:KLIC)
Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools, as well as services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. The Company operates through two segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The Expendable Tools segment manufactures and sells expendable tools for a range of semiconductor packaging applications. It offers capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits, high and low powered discrete devices, light-emitting diodes and power modules. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers and automotive electronics suppliers.