FORMFACTOR, INC. (NASDAQ:FORM) Files An 8-K Submission of Matters to a Vote of Security Holders
Item 5.07. Submission of Matters to a Vote of Security Holders.

FormFactor, Inc. (the “Company”) held its 2018 Annual Meeting of Stockholders (the “Annual Meeting”) on May 18, 2018 at its corporate headquarters at 7005 Southfront Road, Livermore, California 94551. At the meeting, the Company’s stockholders voted on the following four (4) proposals and cast their votes as follows:

Proposal 1: Election of two Class III directors to the Company’s Board of Directors, each to serve for a term of three years or until his successor has been elected and qualified or until his earlier death, resignation or removal. The director nominees were:

Each director nominee was elected a director of the Company.

Proposal 2: Non-binding advisory vote to approve the Company’s executive compensation:

The Company’s stockholders approved, on an advisory basis, the compensation of the named executive officers as disclosed in the Proxy Statement relating to the Annual Meeting.

Proposal 3: Ratification of KPMG LLP as the Company’s independent registered public accounting firm for fiscal year 2018:

This proposal was approved.

Proposal 4: Amendment and restatement of the Company’s Employee Stock Purchase Plan to increase the number of shares reserved for issuance under the Employee Stock Purchase Plan by 3,000,000 shares:

This proposal was approved.

About FORMFACTOR, INC. (NASDAQ:FORM)

FormFactor, Inc. designs, develops, manufactures, sells and supports semiconductor probe card products. The Company is a supplier of probe cards to the manufacturers of dynamic random-access memory (DRAM), flash memory devices, microprocessor, chipset and other system on chip (SoC) devices. Semiconductor manufacturers use its probe cards to perform wafer test, which is the testing of the semiconductor die, or chips. The Company’s products utilize a range of technologies, including micro-electromechanical systems (MEMS) technologies, automation systems, various product architectures and design tools. Its MEMS technologies enable manufacturing of multi-material composite spring-like electrically-conductive contact elements. These contact elements, such as its MicroSpring contacts, optimize the relative amounts of force on, and across, a chip’s bond pad, solder bump or copper pillar during the test process, and maintain their shape and position over a range of compression.