FORMFACTOR, INC. (NASDAQ:FORM) Files An 8-K Amendment to Registrant’s Code of Ethics, or Waiver of a Provision of the Code of EthicsItem 5.05. Amendments to the Registrants Code of Ethics, or Waiver of a Provision of the Code of Ethics
On September 13, 2017, the Board of Directors of FormFactor, Inc. (the “Company”) adopted a revised Code of Business Conduct (the “Code”) that applies to all directors, officers and employees of the Company and its subsidiaries. The Code was revised to provide a more user-friendly presentation, and to set forth a more modern, values-based approach to ethics and compliance topics.
The above summary of the Code is qualified in its entirety by reference to the full text of the Code, which is filed as Exhibit 14.1 to this Current Report on Form 8-K and is incorporated herein by reference. The Code is available on the Investor Relations section of the Company’s web site at www.formfactor.com.
Item 9.01. Financial Statements and Exhibits
(d) Exhibits
The following items are filed as an exhibit to this Current Report on Form 8-K:
| Exhibit No. | Description |
| 14.1 | Code of Business Conduct of FormFactor, Inc. |
EXHIBIT INDEX
| Exhibit No. | Description |
| 14.1 | Code of Business Conduct of FormFactor, Inc. |
FORMFACTOR INC ExhibitEX-14.1 2 dp80570_ex1401.htm EXHIBIT 14.1 EXHIBIT 14.1 Code of Business Conduct FormFactor Honesty Integrity Accountability Trust Respect A Message F R O M Mike Slessor Our success has been based on hard work and a fundamental commitment to integrity in everything we do. In meeting our daily ethics and compliance responsibilities,…To view the full exhibit click here
About FORMFACTOR, INC. (NASDAQ:FORM)
FormFactor, Inc. designs, develops, manufactures, sells and supports semiconductor probe card products. The Company is a supplier of probe cards to the manufacturers of dynamic random-access memory (DRAM), flash memory devices, microprocessor, chipset and other system on chip (SoC) devices. Semiconductor manufacturers use its probe cards to perform wafer test, which is the testing of the semiconductor die, or chips. The Company’s products utilize a range of technologies, including micro-electromechanical systems (MEMS) technologies, automation systems, various product architectures and design tools. Its MEMS technologies enable manufacturing of multi-material composite spring-like electrically-conductive contact elements. These contact elements, such as its MicroSpring contacts, optimize the relative amounts of force on, and across, a chip’s bond pad, solder bump or copper pillar during the test process, and maintain their shape and position over a range of compression.
