Fabrinet (NYSE:FN) Files An 8-K Results of Operations and Financial Condition

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Fabrinet (NYSE:FN) Files An 8-K Results of Operations and Financial Condition
Item 2.02 Results of Operations and Financial Condition.

On February5, 2018, Fabrinet issued a press release regarding its financial results for the fiscal quarter ended December29, 2017. A copy of the press release is attached hereto as Exhibit 99.1 and is incorporated herein by reference.

The information in this Form 8-K and the exhibit attached shall not be deemed “filed” for purposes of Section18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”), nor shall they be deemed incorporated by reference in any filing under the Securities Act of 1933, as amended, or the Exchange Act, except as shall be expressly set forth by specific reference in such a filing.

Item 2.02 Financial Statements and Exhibits.

(d) Exhibits.

ExhibitNo.

Description

99.1 Press release dated February5, 2018


Fabrinet Exhibit
EX-99.1 2 d533419dex991.htm EX-99.1 EX-99.1 Exhibit 99.1 Fabrinet Announces Second Quarter Fiscal Year 2018 Financial Results BANGKOK,…
To view the full exhibit click here

About Fabrinet (NYSE:FN)

Fabrinet provides optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers (OEMs) of products, such as optical communication components, modules and sub-systems, industrial lasers, medical devices and sensors. The Company offers a range of optical and electro-mechanical capabilities across the manufacturing process, including process design and engineering, supply chain management, manufacturing, complex printed circuit board assembly, advanced packaging, integration, final assembly and test. The Company’s customer base includes companies in industries that require precision manufacturing capabilities, such as optical communications, industrial lasers, automotive, medical and sensors. Its customers in these industries support end-markets, including automotive, biotechnology, communications, materials processing, medical devices, metrology and semiconductor processing.