CPS TECHNOLOGIES CORPORATION (NASDAQ:CPSH) Files An 8-K Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers

0
CPS TECHNOLOGIES CORPORATION (NASDAQ:CPSH) Files An 8-K Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers

CPS TECHNOLOGIES CORPORATION (NASDAQ:CPSH) Files An 8-K Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers
Item 5.02 Appointment of Certain Officers

On April 8, 2019, CPS Technologies Corp. announced the selection of Charles K. Griffith Jr. as its Chief Financial Officer. He will assume his responsibilities on May 6, 2019 from Ralph M. Norwood who will be retiring at that time. The press release announcing this selection is attached hereto as Exhibit 99.

EXHIBIT NUMBER

DESCRIPTION
Press Release dated April 8, 2019 announcing the selection of Charles K. Griffith Jr. as its Chief Financial Officer.

CPS TECHNOLOGIES CORP/DE/ Exhibit
EX-99 2 pr04082019griffith.htm PRESS RELEASE DATED APRIL 8,…
To view the full exhibit click here

About CPS TECHNOLOGIES CORPORATION (NASDAQ:CPSH)

CPS Technologies Corporation (CPS) provides material solutions to the transportation, automotive, energy, computing/Internet, telecommunications, aerospace, defense, and oil and gas end markets. Its primary material solution is metal matrix composites (MMCs), which are a class of materials consisting of a combination of metal and ceramic. It designs, manufactures and sells custom MMC components, which manages the performance and reliability of systems in the end markets. It provides lids and heat spreaders used with integrated circuits in Internet switches and routers. It provides baseplates and housings used in modules built with wide band gap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN). The Company also assembles housings and packages for hybrid circuits. These housings and packages may include MMC components. Its products are manufactured by processes, including the Quickset Injection Molding Process and the QuickCast Pressure Infiltration Process.