AMKOR TECHNOLOGY, INC. (NASDAQ:AMKR) Files An 8-K Other Events
Item 8.01 Other Events.
On March 13, 2019, Amkor Technology, Inc. (the “Company”) issued a press release announcing the pricing of its offering of $525,000,000 aggregate principal amount of its 6.625% Senior Notes due 2027 (the “2027 Notes”). The Company also announced its intention to use the proceeds of the offering, together with cash on hand, to redeem in full the $525,000,000 aggregate principal amount of its outstanding 6.375% senior notes due 2022 (the “2022 Notes”). The consummation of the offering of the 2027 Notes will not be conditioned on the redemption of the 2022 Notes. A copy of this press release is attached as Exhibit 99.1 to this Current Report on Form 8-K and is incorporated herein by reference.
This Current Report on Form 8-K does not constitute a notice of redemption of the 2022 Notes.
Item 9.01 Financial Statements and Exhibits.
(d) Exhibits.
AMKOR TECHNOLOGY, INC. Exhibit
EX-99.1 2 ex8k525mnotesdue2027pricing.htm EXHIBIT 99.1 Exhibit Exhibit 99.1News Release Amkor Technology Announces Pricing of $525 Million of its 6.625% Senior Notes due 2027 and Intention to Redeem Senior Notes due 2022TEMPE,…
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About AMKOR TECHNOLOGY, INC. (NASDAQ:AMKR)
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology employed, size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. Fabless semiconductor companies focuses on the semiconductor design process and manufacturing process. Its packages employ wirebond, flip chip, copper clip and other interconnect technologies. It uses leadframe and substrate package carriers, and performs a range of test services.
