Aehr Test Systems (NASDAQ:AEHR) Files An 8-K Entry into a Material Definitive AgreementITEM 1.01. ENTRY INTO A MATERIAL DEFINITIVE AGREEMENT.
On February 27, 2018, Aehr Test Systems (the “Company”) entered into a Third Amendment (the “Amendment”) to that certain Multi-Tenant Office Triple Net Lease dated August 3, 1999, as amended by that certain First Amendment dated as of May 6, 2008 and that certain Second Amendment dated as of November 7, 2014 (the “Lease”) with ICON OWNER POOL 1 SF NON-BUSINESS PARKS, LLC for facilities located at 400 Kato Terrace, Fremont, California.
The Amendment extends the term of the Lease for a period of sixty-one (61) calendar months, commencing on July 1, 2018 and expiring on July 31, 2023, includes an increase in base rent from $39,177.00 to $58,982.35 effective July 1, 2018, and an annual increase in base rent of 3 percent throughout the remainder of the lease term.
The foregoing description of the Amendment does not purport to be complete and is qualified in its entirety by reference to the full text of the Amendment, a copy of which is attached hereto as Exhibit 10.1 and is incorporated herein by reference.
ITEM 9.01. FINANCIAL STATEMENTS AND EXHIBITS.
(d) Exhibits.
Exhibit No. Description
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10.1 Third Amendment dated February 27, 2018 for facilities located at 400 Kato Terrace, Fremont, California.
AEHR TEST SYSTEMS ExhibitEX-10.1 2 aehr_ex10-1.htm THIRD AMENDMENT DATED FEBRUARY 27,…To view the full exhibit click here
About Aehr Test Systems (NASDAQ:AEHR)
Aehr Test Systems is engaged in the designing, manufacturing and marketing of advanced test and burn-in products to the semiconductor manufacturing industry. The Company manufactures and markets full wafer contact test systems, test during burn-in systems, test fixtures, die carriers and related accessories. The Company’s principal products are the Advanced Burn-In and Test System (ABTS), the FOX full wafer contact parallel test and burn-in systems, WaferPak full wafer contactor, the DiePak carrier and test fixtures. The Company develops, manufactures and sells systems, which are designed to reduce the cost of testing and to perform reliability screening, or burn-in, of complex logic devices, memory integrated circuits (ICs), sensors and optical devices. These systems can be used to perform parallel testing and burn-in of packaged ICs, singulated bare die or ICs still in wafer form.
