AMKOR TECHNOLOGY, INC. (NASDAQ:AMKR) Files An 8-K Results of Operations and Financial ConditionItem 2.02. Results of Operations and Financial Condition.
Attached hereto as Exhibit99.1 and incorporated by reference herein is financial information for Amkor Technology, Inc. for the three and six months ended June 30, 2017, and forward-looking statements relating to the third quarter and full year 2017 as presented in a press release dated July31, 2017. The information in this Form 8-K and the exhibit attached hereto is being furnished and shall not be deemed “filed” for purposes of Section18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”) or otherwise subject to the liabilities of that section, nor shall it be deemed incorporated by reference in any filing under the Securities Act of 1933, as amended, or the Exchange Act, regardless of any general incorporation language in such filing.
Item 2.02. Financial Statements and Exhibits.
(d)Exhibits.
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99.1 |
Text of Press Release dated July 31, 2017, which is furnished (not filed) herewith. |
AMKOR TECHNOLOGY, INC. ExhibitEX-99.1 2 amkr63017earningsreleaseex.htm EXHIBIT 99.1 Exhibit News ReleaseAmkor Technology Reports Financial Results for the Second Quarter 2017 Second Quarter Highlights•Net sales $989 million,…To view the full exhibit click here
About AMKOR TECHNOLOGY, INC. (NASDAQ:AMKR)
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology employed, size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. Fabless semiconductor companies focuses on the semiconductor design process and manufacturing process. Its packages employ wirebond, flip chip, copper clip and other interconnect technologies. It uses leadframe and substrate package carriers, and performs a range of test services.
