SCI Engineered Materials, Inc. (OTCMKTS:SCIA) Files An 8-K Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers

SCI Engineered Materials, Inc. (OTCMKTS:SCIA) Files An 8-K Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers
Item 5.02 Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers.

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On May 14, 2018, Daniel Rooney, President, Chief Executive Officer (CEO) and Chairman of the Board of Directors of SCI Engineered Materials informed the Board of Directors (Board) of his plans to retire in June 2019. Mr. Rooney’s retirement is for personal reasons and not in connection with any known disagreement with the Company on any matter. The Board intends to conduct a thorough search and Mr. Rooney expects to work with his successor to ensure a smooth transition.


About SCI Engineered Materials, Inc. (OTCMKTS:SCIA)

SCI Engineered Materials, Inc. (SCI), formerly Superconductive Components, Inc., is a supplier and manufacturer of advanced materials for physical vapor deposition (PVD) thin film applications. The Company focuses on specific markets within the PVD industry, such as photonics, thin film solar, glass, thin film battery and transparent electronics. PVD coatings range from everyday items to computer processors. Every day applications include transparent anti-scratch coatings on eyeglasses, coatings on kitchen faucets, as well as low emissivity glass for household windows. The Company manufactures ceramic, metal, and alloy products for the photonic, photovoltaic, thin film battery, media storage, flat panel display, and semiconductor industries. The Company also develops products for the thin film solar (TFS) market. It produces ceramic powders through various processing techniques, including solid state and precipitation. It produces metal sputtering targets and backing plates.

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