FORMFACTOR, INC. (NASDAQ:FORM) Files An 8-K Results of Operations and Financial Condition

On May 1, 2019, FormFactor, Inc. (FormFactor) issued a press release announcing its financial results for the first>quarter of fiscal 2019>that ended on March 30, 2019. A copy of the press release is furnished as Exhibit 99.01 to this report and is incorporated herein by reference.

Item 9.01. Financial Statements and Exhibits.

(d) Exhibits.

The following exhibit is filed herewith and this list is intended to constitute the exhibit index.

The information in this report and the accompanying exhibit shall not be incorporated by reference into any filing of FormFactor with the Securities and Exchange Commission, whether made before or after the date hereof, regardless of any general incorporation language in such filing, unless expressly incorporated by specific reference in such filing. The information in this report, including the accompanying exhibit, shall not be deemed to be filed for purposes of Section 18 of the Securities Exchange Act of 1934, as amended, or otherwise subject to the liabilities of that section or Sections 11 and 12(a)(2) of the Securities Act of 1933, as amended.

FORMFACTOR INC Exhibit
EX-99.01 2 q119exhibit9901.htm EXHIBIT 99.01 Exhibit EXHIBIT 99.01News Release Investor Contact:Stan FinkelsteinInvestor Relations(925) 290-4321ir@formfactor.com FORMFACTOR,…
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About FORMFACTOR, INC. (NASDAQ:FORM)

FormFactor, Inc. designs, develops, manufactures, sells and supports semiconductor probe card products. The Company is a supplier of probe cards to the manufacturers of dynamic random-access memory (DRAM), flash memory devices, microprocessor, chipset and other system on chip (SoC) devices. Semiconductor manufacturers use its probe cards to perform wafer test, which is the testing of the semiconductor die, or chips. The Company’s products utilize a range of technologies, including micro-electromechanical systems (MEMS) technologies, automation systems, various product architectures and design tools. Its MEMS technologies enable manufacturing of multi-material composite spring-like electrically-conductive contact elements. These contact elements, such as its MicroSpring contacts, optimize the relative amounts of force on, and across, a chip’s bond pad, solder bump or copper pillar during the test process, and maintain their shape and position over a range of compression.