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ELECTRO SCIENTIFIC INDUSTRIES, INC. (NASDAQ:ESIO) Files An 8-K Results of Operations and Financial Condition

ELECTRO SCIENTIFIC INDUSTRIES, INC. (NASDAQ:ESIO) Files An 8-K Results of Operations and Financial ConditionItem 2.02Results of Operations and Financial Condition

On January17, 2018, Electro Scientific Industries, Inc. (the “Company”) announced its preliminary results for revenue, adjusted earnings per diluted share and bookings for the third fiscal quarter of 2018. The Company’s press release is attached as Exhibit 99.1 and incorporated herein by reference.

Item 9.01Financial Statements and Exhibits

(d) Exhibits

99.1Press release dated January17, 2018

Exhibit Index

Exhibit No.

Description

99.1

Press release dated January 17, 2018

ELECTRO SCIENTIFIC INDUSTRIES INC ExhibitEX-99.1 2 exhibit991preearningsrelea.htm EXHIBIT 99.1 Exhibit Brian SmithESI503-672-5760                     smithb@esi.com ESI Reports Strong Preliminary Third Quarter 2018 Financial ResultsPORTLAND,…To view the full exhibit click here
About ELECTRO SCIENTIFIC INDUSTRIES, INC. (NASDAQ:ESIO)
Electro Scientific Industries, Inc. and its subsidiaries supply laser-based manufacturing solutions for industries reliant on microtechnologies. The Company operates through two segments: Component Processing and Micromachining. The Component Processing segment includes interconnect products, semiconductor products and component products. The interconnect, semiconductor and component products are sold to manufacturers of electronic components and are used to drill, cut, trim, ablate and test and mark features for the functionality of the component. The Micromachining segment includes products that are sold to manufacturers of end devices across various industries and are used to drill, cut or mark features on a range of materials, generally on the casing or external surface of the end device. Its integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials. It has operations in Asia, Europe and North America.

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