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ELECTRO SCIENTIFIC INDUSTRIES, INC. (NASDAQ:ESIO) Files An 8-K Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers

ELECTRO SCIENTIFIC INDUSTRIES, INC. (NASDAQ:ESIO) Files An 8-K Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain OfficersItem 5.02Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers

(a) Departure of Directors

On October 13, 2017, Mr. John Medica, a director of Electro Scientific Industries, Inc. (the “Company”), passed away unexpectedly. Mr. Medica had been a member of the Company’s Board of Directors since 2015 and was chair of the Nominating and Corporate Governance Committee. The Company issued a press release, attached as Exhibit 99.1 hereto, in appreciation of Mr. Medica’s service to the Company.

Item 9.01Financial Statements and Exhibits

(d) Exhibits

99.1Press release dated October 18, 2017

Exhibit Index

Exhibit No.

Description

99.1

Press release dated October 18, 2017

ELECTRO SCIENTIFIC INDUSTRIES INC ExhibitEX-99.1 2 exhibit991pr-medica.htm EXHIBIT 99.1 Exhibit Brian Smith                                            503-672-5760smithb@esi.comESI Announces Passing of Board Member John MedicaPORTLAND,…To view the full exhibit click here
About ELECTRO SCIENTIFIC INDUSTRIES, INC. (NASDAQ:ESIO)
Electro Scientific Industries, Inc. and its subsidiaries supply laser-based manufacturing solutions for industries reliant on microtechnologies. The Company operates through two segments: Component Processing and Micromachining. The Component Processing segment includes interconnect products, semiconductor products and component products. The interconnect, semiconductor and component products are sold to manufacturers of electronic components and are used to drill, cut, trim, ablate and test and mark features for the functionality of the component. The Micromachining segment includes products that are sold to manufacturers of end devices across various industries and are used to drill, cut or mark features on a range of materials, generally on the casing or external surface of the end device. Its integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials. It has operations in Asia, Europe and North America.

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