AMKOR TECHNOLOGY, INC. (NASDAQ:AMKR) Files An 8-K Other Events

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AMKOR TECHNOLOGY, INC. (NASDAQ:AMKR) Files An 8-K Other Events

ITEM 8.01 Other Events.

Amkor Technology, Inc. (the Company) today announced that it has
issued a notice for the redemption of $200 million of the
outstanding $400 million aggregate principal amount of its 6.625%
Senior Notes due 2021 (the Notes), with the redemption to be
effective on July 19, 2017. As provided in the indenture
governing the Notes, the redemption price will be 101.656% of the
principal amount of the Notes, or $1,016.56 per $1,000.00
principal amount thereof, paid in cash. In addition, the Company
will pay accrued and unpaid interest on the Notes to, but
excluding, the redemption date, in accordance with the terms of
the indenture. The Company plans to fund the redemption of the
Notes with cash on hand.
A copy of the press release is attached herewith as Exhibit 99.1
and is incorporated herein by reference.
ITEM 9.01 Financial Statements and Exhibits.
(d) Exhibits.
Exhibit
Description
99.1
Press release, dated June 19, 2017, announcing notice
of redemption



AMKOR TECHNOLOGY, INC. Exhibit
EX-99.1 2 noticeofredemptionexhibit.htm EXHIBIT 99.1 Exhibit     EXHIBIT 99.1News ReleaseAmkor Technology Announces Notice of Partial Redemption of 6.625% Senior Notes due 2021TEMPE,…
To view the full exhibit click here
About AMKOR TECHNOLOGY, INC. (NASDAQ:AMKR)

Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology employed, size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. Fabless semiconductor companies focuses on the semiconductor design process and manufacturing process. Its packages employ wirebond, flip chip, copper clip and other interconnect technologies. It uses leadframe and substrate package carriers, and performs a range of test services.

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